Ieee Transactions On Components Packaging And Manufacturing Technology

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

《IEEE 元器件、封装和制造技术学报》发表有关电子、光子和 MEMS 封装的建模、设计、构建模块、技术基础设施和分析的研究和应用文章，此外还发表无源元件、电触点和连接器、热管理和设备可靠性方面的新发展；以及电子零件和组件的制造，广泛涵盖设计、工厂建模、装配方法、质量、产品稳健性和环境设计。

该刊已被国际权威数据库SCI、SCIE收录，该刊致力于发表经过严格同行评审的高质量原创文章，反映ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC领域的新进展、新技术、新成果，促进该领域科研交流和科研成果转化。该刊2026年影响因子为3.3，平均审稿速度为一般,3-6周，近四年来没有被列入预警名单。如果您需要投稿发表服务及指导，可以联系我们的客服老师，我们专业专注服务期刊投稿协助10年，为您提供期刊投稿个性化定制服务，并且我们确保严格保密您的个人信息及稿件内容。