摘要:低熔点Sn—Bi焊料是比较有发展潜力的低温无Pb焊料.根据Sn—Bi焊料的特性及其应用存在的问题,结合近几年国内外对Sn—Bi系低温无Pb焊料的最新研究成果,综述了Sn—Bi无Pb焊料的温度诱导熔体结构转变现象及其对Sn—Bi焊料凝固组织的影响,介绍了合金元素及稀土元素的添加对Sn~Bi焊料润湿性能的影响及其影响机制,并分类总结了不同元素对Sn—Bi焊料与Cu基体界面化合物生长的促进与抑制作用及其原理,最后综合评述Sn—Bi低温无Pb焊料存在的问题,对Sn—Bi焊料的发展趋势进行了展望.
注:因版权方要求,不能公开全文,如需全文,请咨询杂志社
热门期刊
Transactions of Nonferrous Metals Society of China Science China Technological Sciences Research in Astronomy and Astrophysics Biomedical and Environmental Sciences Plasma Science and Technology The Journal of China Universities of Posts and Telecommunications Journal of Materials Science Technology Journal of Mountain Science Journal of Systematics and Evolution Tsinghua Science and Technology High Technology Letters Journal of Semiconductors